| PART |
Description |
Maker |
| 21-0147C |
PACKAGE OUTLINE 6L UDFN 1.5 X 1.0 X 0.8mm
|
MAXIM - Dallas Semiconductor
|
| STEVAL-IFS017V3 |
Temperature sensor daughter card based on the STTS751-1DP3F in UDFN package
|
ST Microelectronics
STMicroelectronics
|
| NUF8000MUT2G NUF8000MU |
Low Capacitance 8 Line EMI Filter with ESD Protection in UDFN Package
|
ON Semiconductor
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| TQFN3X6-32 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-12 |
Package Outline
|
Global Mixed-mode Techn...
|
